Laser focus depth adaptation for decapsulation of copper wirebonded devices

• Main Authors: Kor, Katherine Hwee Boon, Liu, Qing, Siah, Yu Wen, Gan, Chee Lip
• 其他作者: School of Materials Science & Engineering
• 格式: Conference or Workshop Item
• 語言: English
• 出版: 2015
• 主題: DRNTU::Engineering::Materials::Metallic materials
• 在線閱讀: https://hdl.handle.net/10356/107318; http://hdl.handle.net/10220/25336; http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices
• 機構: Nanyang Technological University

Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFP...