Laser focus depth adaptation for decapsulation of copper wirebonded devices
Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFP...
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| Main Authors: | , , , |
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| 格式: | Conference or Workshop Item |
| 語言: | English |
| 出版: |
2015
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/107318 http://hdl.handle.net/10220/25336 http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices |
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