Analysis of temperature profile on a PCB in the preheat section of a wave soldering process

In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, p...

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書目詳細資料
主要作者:	Hoe, Swee Long.
其他作者:	Toh, Kok Chuan
格式:	Theses and Dissertations
語言:	English
出版:	2008
主題:	DRNTU::Engineering::Manufacturing::Product engineering
在線閱讀:	http://hdl.handle.net/10356/13489
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	Nanyang Technological University
語言:	English

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