Indentation crack formation and interaction on pure and metallised Si wafers

• المؤلف الرئيسي: Su, Dan.
• مؤلفون آخرون: Manoharan, Mohan
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/13535
• المؤسسة: Nanyang Technological University

The metallization of Si represents an important industrial process and produces a bi-layered composite of a ductile metal film on a brittle substrate. The mechanical properties of such a composite are determined by the properties of the two layers and the interface and influenced by the fact that th...