Scheduling dual-arm cluster tools with multiple wafer types and residency time constraints

• Main Authors: Wang, Jipeng, Hu, Hesuan, Pan, Chunrong, Zhou, Yuan, Li, Liang
• Other Authors: School of Computer Science and Engineering
• Format: Article
• Language: English
• Published: 2020
• Subjects: Engineering::Electrical and electronic engineering; Cluster Tools; Multiple Wafer Types
• Online Access: https://hdl.handle.net/10356/145527
• Institution: Nanyang Technological University

Accompanying the unceasing progress of integrated circuit manufacturing technology, the mainstream production mode of current semiconductor wafer fabrication is featured with multi-variety, small batch, and individual customization, which poses a huge challenge to the scheduling of cluster tools with single-wafer-type fabrication. Concurrent processing multiple wafer types in cluster tools, as a novel production pattern, has drawn increasing attention from industry to academia, whereas the corresponding research remains insufficient. This paper investigates the scheduling problems of dual-arm cluster tools with multiple wafer types and residency time constraints. To pursue an easy-to-implement cyclic operation under diverse flow patterns, we develop a novel robot activity strategy called multiplex swap sequence. In the light of the virtual module technology, the workloads that stem from bottleneck process steps and asymmetrical process configuration are balanced satisfactorily. Moreover, several sufficient and necessary conditions with closed-form expressions are obtained for checking the system's schedulability. Finally, efficient algorithms with polynomial complexity are developed to find the periodic scheduling, and its practicability and availability are demonstrated by the offered illustrative examples.