Scheduling dual-arm cluster tools with multiple wafer types and residency time constraints

• Main Authors: Wang, Jipeng, Hu, Hesuan, Pan, Chunrong, Zhou, Yuan, Li, Liang
• Other Authors: School of Computer Science and Engineering
• Format: Article
• Language: English
• Published: 2020
• Subjects: Engineering::Electrical and electronic engineering; Cluster Tools; Multiple Wafer Types
• Online Access: https://hdl.handle.net/10356/145527
• Institution: Nanyang Technological University

Accompanying the unceasing progress of integrated circuit manufacturing technology, the mainstream production mode of current semiconductor wafer fabrication is featured with multi-variety, small batch, and individual customization, which poses a huge challenge to the scheduling of cluster tools wit...