Scheduling dual-arm cluster tools with multiple wafer types and residency time constraints

• المؤلفون الرئيسيون: Wang, Jipeng, Hu, Hesuan, Pan, Chunrong, Zhou, Yuan, Li, Liang
• مؤلفون آخرون: School of Computer Science and Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2020
• الموضوعات: Engineering::Electrical and electronic engineering; Cluster Tools; Multiple Wafer Types
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/145527

Accompanying the unceasing progress of integrated circuit manufacturing technology, the mainstream production mode of current semiconductor wafer fabrication is featured with multi-variety, small batch, and individual customization, which poses a huge challenge to the scheduling of cluster tools wit...