Scheduling dual-arm cluster tools with multiple wafer types and residency time constraints

• Main Authors: Wang, Jipeng, Hu, Hesuan, Pan, Chunrong, Zhou, Yuan, Li, Liang
• 其他作者: School of Computer Science and Engineering
• 格式: Article
• 語言: English
• 出版: 2020
• 主題: Engineering::Electrical and electronic engineering; Cluster Tools; Multiple Wafer Types
• 在線閱讀: https://hdl.handle.net/10356/145527
• 機構: Nanyang Technological University

Accompanying the unceasing progress of integrated circuit manufacturing technology, the mainstream production mode of current semiconductor wafer fabrication is featured with multi-variety, small batch, and individual customization, which poses a huge challenge to the scheduling of cluster tools wit...