Highly conductive aligned carbon film for interconnect application

We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electri...

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Main Authors:	Li, Fushan, Shakerzadeh, Maziar, Tan, Chong Wei, Yu, Hongyu, Tay, Beng Kang
Other Authors:	School of Electrical and Electronic Engineering
Format:	Conference or Workshop Item
Language:	English
Published:	2021
Subjects:	Engineering::Electrical and electronic engineering Carbon Film Microstructure
Online Access:	https://hdl.handle.net/10356/151181
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Institution:	Nanyang Technological University
Language:	English

id	sg-ntu-dr.10356-151181
record_format	dspace
spelling	sg-ntu-dr.10356-1511812021-06-07T06:23:53Z Highly conductive aligned carbon film for interconnect application Li, Fushan Shakerzadeh, Maziar Tan, Chong Wei Yu, Hongyu Tay, Beng Kang School of Electrical and Electronic Engineering 2010 3rd International Nanoelectronics Conference (INEC) Engineering::Electrical and electronic engineering Carbon Film Microstructure We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application. Accepted version 2021-06-07T06:23:53Z 2021-06-07T06:23:53Z 2010 Conference Paper Li, F., Shakerzadeh, M., Tan, C. W., Yu, H. & Tay, B. K. (2010). Highly conductive aligned carbon film for interconnect application. 2010 3rd International Nanoelectronics Conference (INEC), 730-731. https://dx.doi.org/10.1109/INEC.2010.5424560 9781424435449 https://hdl.handle.net/10356/151181 10.1109/INEC.2010.5424560 2-s2.0-77951654025 730 731 en © 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/INEC.2010.5424560. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
language	English
topic	Engineering::Electrical and electronic engineering Carbon Film Microstructure
spellingShingle	Engineering::Electrical and electronic engineering Carbon Film Microstructure Li, Fushan Shakerzadeh, Maziar Tan, Chong Wei Yu, Hongyu Tay, Beng Kang Highly conductive aligned carbon film for interconnect application
description	We demonstrate here an amorphous carbon film with a highly conductive transition phase for interconnect application. The uniform orientation of graphite-like sheet provides an effective carriers transport channel, thus significantly improves the conductivity of the amorphous carbon film. The electrical properties of the aligned carbon film are investigated using Kelvin structure. Our results show that the resistivity of aligned carbon film is comparable with that of Cu, and the aligned carbon film holds promise for future interconnect application.
author2	School of Electrical and Electronic Engineering
author_facet	School of Electrical and Electronic Engineering Li, Fushan Shakerzadeh, Maziar Tan, Chong Wei Yu, Hongyu Tay, Beng Kang
format	Conference or Workshop Item
author	Li, Fushan Shakerzadeh, Maziar Tan, Chong Wei Yu, Hongyu Tay, Beng Kang
author_sort	Li, Fushan
title	Highly conductive aligned carbon film for interconnect application
title_short	Highly conductive aligned carbon film for interconnect application
title_full	Highly conductive aligned carbon film for interconnect application
title_fullStr	Highly conductive aligned carbon film for interconnect application
title_full_unstemmed	Highly conductive aligned carbon film for interconnect application
title_sort	highly conductive aligned carbon film for interconnect application
publishDate	2021
url	https://hdl.handle.net/10356/151181
_version_	1702431305432563712

Highly conductive aligned carbon film for interconnect application

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