Thermal simulations of 3D through silicon via-based ion traps

• 主要作者: Bi, Xinwen
• 其他作者: Tan Chuan Seng
• 格式: Thesis-Master by Coursework
• 語言: English
• 出版: Nanyang Technological University 2022
• 主題: Engineering::Electrical and electronic engineering::Electronic packaging
• 在線閱讀: https://hdl.handle.net/10356/155524
• 機構: Nanyang Technological University

This work presents possible solutions to mitigate the temperature increase concern in through silicon via (TSV) integrated ion traps using two approaches: (1) heat generation reduction and (2) heat dissipation enhancement. A power loss and temperature increase associated with the ion trap is care...