Thermal simulations of 3D through silicon via-based ion traps

• المؤلف الرئيسي: Bi, Xinwen
• مؤلفون آخرون: Tan Chuan Seng
• التنسيق: Thesis-Master by Coursework
• اللغة: English
• منشور في: Nanyang Technological University 2022
• الموضوعات: Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/155524
• المؤسسة: Nanyang Technological University

This work presents possible solutions to mitigate the temperature increase concern in through silicon via (TSV) integrated ion traps using two approaches: (1) heat generation reduction and (2) heat dissipation enhancement. A power loss and temperature increase associated with the ion trap is care...