Electron backscatter diffraction study for advanced semiconductor interconnect materials analysis

• Main Author: Lee, Aaron Wai Ken
• Other Authors: Gan Chee Lip
• Format: Thesis-Master by Research
• Language: English
• Published: Nanyang Technological University 2022
• Subjects: Engineering::Materials
• Online Access: https://hdl.handle.net/10356/159399
• Institution: Nanyang Technological University

3-dimensional (3D) semiconductor packaging and interconnection technology, which involves vertically stack IC chips that are electrically interconnected by inter-layer vias and solder joints, is being used to achieve better performance, lower power consumption, and higher integration capability. As...