Electron backscatter diffraction study for advanced semiconductor interconnect materials analysis
3-dimensional (3D) semiconductor packaging and interconnection technology, which involves vertically stack IC chips that are electrically interconnected by inter-layer vias and solder joints, is being used to achieve better performance, lower power consumption, and higher integration capability. As...
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| Format: | Thesis-Master by Research |
| Language: | English |
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Nanyang Technological University
2022
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| Online Access: | https://hdl.handle.net/10356/159399 |
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| Institution: | Nanyang Technological University |
| Language: | English |