Multi-foci laser separation of sapphire wafers with partial thickness scanning

• Main Authors: Lye, Celescia Siew Mun, Wang, Zhongke, Lam, Yee Cheong
• 其他作者: School of Mechanical and Aerospace Engineering
• 格式: Article
• 語言: English
• 出版: 2022
• 主題: Engineering::Mechanical engineering; Multi-Foci; Two-zone Partial Thickness Scanning
• 在線閱讀: https://hdl.handle.net/10356/160544

With multi-foci laser cutting technology for sapphire wafer separation, the entire cross-section is generally scanned with single or multiple passes. This investigation proposes a new separation technique through partial thickness scanning. The energy effectivity and efficiency of the picosecond las...