Multi-foci laser separation of sapphire wafers with partial thickness scanning

• Main Authors: Lye, Celescia Siew Mun, Wang, Zhongke, Lam, Yee Cheong
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2022
• Subjects: Engineering::Mechanical engineering; Multi-Foci; Two-zone Partial Thickness Scanning
• Online Access: https://hdl.handle.net/10356/160544
• Institution: Nanyang Technological University

With multi-foci laser cutting technology for sapphire wafer separation, the entire cross-section is generally scanned with single or multiple passes. This investigation proposes a new separation technique through partial thickness scanning. The energy effectivity and efficiency of the picosecond las...