Multi-foci laser separation of sapphire wafers with partial thickness scanning
With multi-foci laser cutting technology for sapphire wafer separation, the entire cross-section is generally scanned with single or multiple passes. This investigation proposes a new separation technique through partial thickness scanning. The energy effectivity and efficiency of the picosecond las...
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Main Authors: | Lye, Celescia Siew Mun, Wang, Zhongke, Lam, Yee Cheong |
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Other Authors: | School of Mechanical and Aerospace Engineering |
Format: | Article |
Language: | English |
Published: |
2022
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/160544 |
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Institution: | Nanyang Technological University |
Language: | English |
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