Decapsulation of IC packages with silver wire bonds for failure analysis
Failure analysis in Integrated Circuits (IC) packages has always played a vital role in supporting manufacturing modules in the semiconductor industry. Failure analysis can provide essential information on product failure modes that ensure the employment of accurate corrective actions to improve qua...
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| 格式: | Final Year Project |
| 語言: | English |
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Nanyang Technological University
2023
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| 在線閱讀: | https://hdl.handle.net/10356/166877 |
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| 機構: | Nanyang Technological University |
| 語言: | English |
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