Heating dissipation discussion of TSV-integrated ion trap with glass interposer

Heating dissipation discussion of TSV-integrated ion trap with glass interposer

In this work, we discuss the possible solutions to mitigate the temperature increase issue in TSV integrated ion trap with two approaches: (1) heat generation reduction, and (2) heat dissipation enhancement. We investigate the effect of electrical conductivity of silicon, grounding plane, number of...

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Main Authors: Zhao, Peng, Bi, Xin Wen, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
其他作者: School of Electrical and Electronic Engineering
格式: Conference or Workshop Item
語言:English
出版: 2024
主題:
Engineering
Heating systems
Electron traps
在線閱讀:https://hdl.handle.net/10356/175558
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https://hdl.handle.net/10356/175558

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