Heating dissipation discussion of TSV-integrated ion trap with glass interposer

• Main Authors: Zhao, Peng, Bi, Xin Wen, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2024
• Subjects: Engineering; Heating systems; Electron traps
• Online Access: https://hdl.handle.net/10356/175558
• Institution: Nanyang Technological University

In this work, we discuss the possible solutions to mitigate the temperature increase issue in TSV integrated ion trap with two approaches: (1) heat generation reduction, and (2) heat dissipation enhancement. We investigate the effect of electrical conductivity of silicon, grounding plane, number of...