Computer vision approaches for automatic inspection of wire bonding of semiconductor devices

• 主要作者: Lim, Han Ooi.
• 其他作者: Koh, Liang Mong
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2009
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
• 在線閱讀: http://hdl.handle.net/10356/19635
• 機構: Nanyang Technological University

There is a demand in the semiconductor industries for geometry inspection of the wire bonding balls on an integrated circuit. This is currently being carried out manually by human operator with the aid of a 500X magnification microscope. This thesis shows that simple image processing technique can b...