Springback study on leads of quad flat package
This report presents the study of springback on leads of Quad Flat Package (QFP). One of the factors which affect the forming performance of leads of Quad Flat Package is the springback phenomenon. The amount of springback of QFP copper leads after forming has been studied. An analytical method and...
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2009
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sg-ntu-dr.10356-198352023-03-11T16:51:55Z Springback study on leads of quad flat package Rita Gozali. S.Thiruvarudchelvan School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing::Product engineering This report presents the study of springback on leads of Quad Flat Package (QFP). One of the factors which affect the forming performance of leads of Quad Flat Package is the springback phenomenon. The amount of springback of QFP copper leads after forming has been studied. An analytical method and a finite element modelling are developed to determine the springback. The results obtained are compared with the experimental measurements. The springback value of closed-form solution compares well with the experimental measurement. When the standard deviation of the measured experimental springback value is taken into consideration, the calculated springback value is within the measured experimental springback population range. The finite element modelling results also correlate relatively well with the experimental measurements. Master of Science (Mechanics & Processing of Materials) 2009-12-14T06:50:08Z 2009-12-14T06:50:08Z 1996 1996 Thesis http://hdl.handle.net/10356/19835 en NANYANG TECHNOLOGICAL UNIVERSITY 71 p. application/pdf |
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Asia |
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Singapore Singapore |
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DRNTU::Engineering::Manufacturing::Product engineering |
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DRNTU::Engineering::Manufacturing::Product engineering Rita Gozali. Springback study on leads of quad flat package |
| description |
This report presents the study of springback on leads of Quad Flat Package (QFP). One of the factors which affect the forming performance of leads of Quad Flat Package is the springback phenomenon. The amount of springback of QFP copper leads after forming has been studied. An analytical method and a finite element modelling are developed to determine the springback. The results obtained are compared with the experimental measurements. The springback value of closed-form solution compares well with the experimental measurement. When the standard deviation of the measured experimental springback value is taken into consideration, the calculated springback value is within the measured experimental springback population range. The finite element modelling results also correlate relatively well with the experimental measurements. |
| author2 |
S.Thiruvarudchelvan |
| author_facet |
S.Thiruvarudchelvan Rita Gozali. |
| format |
Theses and Dissertations |
| author |
Rita Gozali. |
| author_sort |
Rita Gozali. |
| title |
Springback study on leads of quad flat package |
| title_short |
Springback study on leads of quad flat package |
| title_full |
Springback study on leads of quad flat package |
| title_fullStr |
Springback study on leads of quad flat package |
| title_full_unstemmed |
Springback study on leads of quad flat package |
| title_sort |
springback study on leads of quad flat package |
| publishDate |
2009 |
| url |
http://hdl.handle.net/10356/19835 |
| _version_ |
1761781511772700672 |