Springback study on leads of quad flat package
This report presents the study of springback on leads of Quad Flat Package (QFP). One of the factors which affect the forming performance of leads of Quad Flat Package is the springback phenomenon. The amount of springback of QFP copper leads after forming has been studied. An analytical method and...
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| Main Author: | |
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| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/19835 |
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| Institution: | Nanyang Technological University |
| Language: | English |