Springback study on leads of quad flat package
This report presents the study of springback on leads of Quad Flat Package (QFP). One of the factors which affect the forming performance of leads of Quad Flat Package is the springback phenomenon. The amount of springback of QFP copper leads after forming has been studied. An analytical method and...
Saved in:
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2009
|
| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/19835 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | Nanyang Technological University |
| 語言: | English |