Use of microporous heat sink for high-heat flux electronics
Cooling technique is an important factor for the development of electronic systems. The low permeability microporous material has been used as an effective heat sink for thermal management for electronic devices, because it can provide a large surface area to volume ratio and enhance the heat transf...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/19929 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | Cooling technique is an important factor for the development of electronic systems. The low permeability microporous material has been used as an effective heat sink for thermal management for electronic devices, because it can provide a large surface area to volume ratio and enhance the heat transfer. This thesis presents results of an analytical study on the flow field and the heat transfer of using the low permeability porous medium as a heat sink for cooling of electronic devices. |
|---|