Use of microporous heat sink for high-heat flux electronics

Cooling technique is an important factor for the development of electronic systems. The low permeability microporous material has been used as an effective heat sink for thermal management for electronic devices, because it can provide a large surface area to volume ratio and enhance the heat transf...

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Main Author: Cui, Chi.
Other Authors: Huang, Xiaoyang
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19929
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-199292023-03-11T17:20:20Z Use of microporous heat sink for high-heat flux electronics Cui, Chi. Huang, Xiaoyang School of Mechanical and Production Engineering DRNTU::Engineering::Mechanical engineering Cooling technique is an important factor for the development of electronic systems. The low permeability microporous material has been used as an effective heat sink for thermal management for electronic devices, because it can provide a large surface area to volume ratio and enhance the heat transfer. This thesis presents results of an analytical study on the flow field and the heat transfer of using the low permeability porous medium as a heat sink for cooling of electronic devices. Master of Engineering (MPE) 2009-12-14T07:51:45Z 2009-12-14T07:51:45Z 1997 1997 Thesis http://hdl.handle.net/10356/19929 en NANYANG TECHNOLOGICAL UNIVERSITY 89 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Mechanical engineering
spellingShingle DRNTU::Engineering::Mechanical engineering
Cui, Chi.
Use of microporous heat sink for high-heat flux electronics
description Cooling technique is an important factor for the development of electronic systems. The low permeability microporous material has been used as an effective heat sink for thermal management for electronic devices, because it can provide a large surface area to volume ratio and enhance the heat transfer. This thesis presents results of an analytical study on the flow field and the heat transfer of using the low permeability porous medium as a heat sink for cooling of electronic devices.
author2 Huang, Xiaoyang
author_facet Huang, Xiaoyang
Cui, Chi.
format Theses and Dissertations
author Cui, Chi.
author_sort Cui, Chi.
title Use of microporous heat sink for high-heat flux electronics
title_short Use of microporous heat sink for high-heat flux electronics
title_full Use of microporous heat sink for high-heat flux electronics
title_fullStr Use of microporous heat sink for high-heat flux electronics
title_full_unstemmed Use of microporous heat sink for high-heat flux electronics
title_sort use of microporous heat sink for high-heat flux electronics
publishDate 2009
url http://hdl.handle.net/10356/19929
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