Use of microporous heat sink for high-heat flux electronics

• Main Author: Cui, Chi.
• Other Authors: Huang, Xiaoyang
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/19929
• Institution: Nanyang Technological University

Cooling technique is an important factor for the development of electronic systems. The low permeability microporous material has been used as an effective heat sink for thermal management for electronic devices, because it can provide a large surface area to volume ratio and enhance the heat transf...