Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies.
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/2499 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Summary: | The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. |
|---|