Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications

The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies.

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Bibliographic Details
Main Author:	Teo, Mary.
Other Authors:	Mhaisalkar, Subodh Gautam
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Material testing and characterization
Online Access:	http://hdl.handle.net/10356/2499
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-2499
record_format	dspace
spelling	sg-ntu-dr.10356-24992023-03-04T00:29:57Z Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications Teo, Mary. Mhaisalkar, Subodh Gautam School of Computer Engineering DRNTU::Engineering::Materials::Material testing and characterization The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies. Master of Philosophy 2008-09-17T09:04:11Z 2008-09-17T09:04:11Z 2003 2003 Thesis http://hdl.handle.net/10356/2499 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Material testing and characterization
spellingShingle	DRNTU::Engineering::Materials::Material testing and characterization Teo, Mary. Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
description	The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies.
author2	Mhaisalkar, Subodh Gautam
author_facet	Mhaisalkar, Subodh Gautam Teo, Mary.
format	Theses and Dissertations
author	Teo, Mary.
author_sort	Teo, Mary.
title	Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
title_short	Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
title_full	Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
title_fullStr	Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
title_full_unstemmed	Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
title_sort	anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
publishDate	2008
url	http://hdl.handle.net/10356/2499
_version_	1759857217079607296

Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications

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