Anisotropic conductive adhesives for micro joining in semiconductor interconnect applications
The main objective in this study was to identify the impact of material properties on reliability, so as to engineer highly reliable microelectronics assemblies.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/2499 |
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| Institution: | Nanyang Technological University |