A study of effect of ICPA on RF CBGA packages
Most radio frequency integrated circuit (RFIC) designers concentrate their characterization effort on the die. Often the package design is being overlooked. Due to the growing concerns in high frequency design, consideration of parasitic effects for the bonding wires is essential in integrated circu...
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2008
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| Online Access: | http://hdl.handle.net/10356/3157 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-31572023-07-04T15:43:57Z A study of effect of ICPA on RF CBGA packages Qiu, Xue Dong. Zhang, Yue Ping School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Most radio frequency integrated circuit (RFIC) designers concentrate their characterization effort on the die. Often the package design is being overlooked. Due to the growing concerns in high frequency design, consideration of parasitic effects for the bonding wires is essential in integrated circuit (IC) packaging of radio frequency (RF) and deep submicron high speed very large scale integrated (VLSI) circuits. Master of Science (Consumer Electronics) 2008-09-17T09:23:32Z 2008-09-17T09:23:32Z 2004 2004 Thesis http://hdl.handle.net/10356/3157 Nanyang Technological University application/pdf |
| institution |
Nanyang Technological University |
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Asia |
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Singapore Singapore |
| content_provider |
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| topic |
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
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DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Qiu, Xue Dong. A study of effect of ICPA on RF CBGA packages |
| description |
Most radio frequency integrated circuit (RFIC) designers concentrate their characterization effort on the die. Often the package design is being overlooked. Due to the growing concerns in high frequency design, consideration of parasitic effects for the bonding wires is essential in integrated circuit (IC) packaging of radio frequency (RF) and deep submicron high speed very large scale integrated (VLSI) circuits. |
| author2 |
Zhang, Yue Ping |
| author_facet |
Zhang, Yue Ping Qiu, Xue Dong. |
| format |
Theses and Dissertations |
| author |
Qiu, Xue Dong. |
| author_sort |
Qiu, Xue Dong. |
| title |
A study of effect of ICPA on RF CBGA packages |
| title_short |
A study of effect of ICPA on RF CBGA packages |
| title_full |
A study of effect of ICPA on RF CBGA packages |
| title_fullStr |
A study of effect of ICPA on RF CBGA packages |
| title_full_unstemmed |
A study of effect of ICPA on RF CBGA packages |
| title_sort |
study of effect of icpa on rf cbga packages |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/3157 |
| _version_ |
1772827252834172928 |