A study of effect of ICPA on RF CBGA packages

• Main Author: Qiu, Xue Dong.
• Other Authors: Zhang, Yue Ping
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/3157
• Institution: Nanyang Technological University

Most radio frequency integrated circuit (RFIC) designers concentrate their characterization effort on the die. Often the package design is being overlooked. Due to the growing concerns in high frequency design, consideration of parasitic effects for the bonding wires is essential in integrated circu...