Source line resistance failure issues and process optimisation of self aligned source etch

A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing.

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Bibliographic Details
Main Author:	Su, Julia Hui Fong.
Other Authors:	Prasad, Krishnamachar
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:	http://hdl.handle.net/10356/3297
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-3297
record_format	dspace
spelling	sg-ntu-dr.10356-32972023-07-04T16:05:38Z Source line resistance failure issues and process optimisation of self aligned source etch Su, Julia Hui Fong. Prasad, Krishnamachar School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing. Master of Science (Microelectronics) 2008-09-17T09:26:47Z 2008-09-17T09:26:47Z 2004 2004 Thesis http://hdl.handle.net/10356/3297 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Su, Julia Hui Fong. Source line resistance failure issues and process optimisation of self aligned source etch
description	A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing.
author2	Prasad, Krishnamachar
author_facet	Prasad, Krishnamachar Su, Julia Hui Fong.
format	Theses and Dissertations
author	Su, Julia Hui Fong.
author_sort	Su, Julia Hui Fong.
title	Source line resistance failure issues and process optimisation of self aligned source etch
title_short	Source line resistance failure issues and process optimisation of self aligned source etch
title_full	Source line resistance failure issues and process optimisation of self aligned source etch
title_fullStr	Source line resistance failure issues and process optimisation of self aligned source etch
title_full_unstemmed	Source line resistance failure issues and process optimisation of self aligned source etch
title_sort	source line resistance failure issues and process optimisation of self aligned source etch
publishDate	2008
url	http://hdl.handle.net/10356/3297
_version_	1772826120932032512

Source line resistance failure issues and process optimisation of self aligned source etch

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