Source line resistance failure issues and process optimisation of self aligned source etch

• Main Author: Su, Julia Hui Fong.
• Other Authors: Prasad, Krishnamachar
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: http://hdl.handle.net/10356/3297
• Institution: Nanyang Technological University

A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing.