Source line resistance failure issues and process optimisation of self aligned source etch
A self-aligned source oxide etch recipe using low power recipe was changed to higher power recipe to improve production cycle time (due to higher etch rate) and resolve plasma un-ignition. However, some lots started to fail with higher source line resistance during electrical testing.
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/3297 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |