Stress measurement in copper films
The aim is to study the behaviour of copper film stack deposited on silicon wafers as a function of temperature and time by monitoring the sample curvvature during a specified thermal history.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/3545 |
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| Institution: | Nanyang Technological University |