Realization of trenched SOI structure using wafer bonding technique
In this project, the realization of a trenched SOI substrate is carried out, and the characterization of the CMP planarization together with a new polysilicon shallow trench isolation (STI) technique is studied.
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| Format: | Theses and Dissertations |
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2008
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| Online Access: | http://hdl.handle.net/10356/3559 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-35592023-07-04T15:07:07Z Realization of trenched SOI structure using wafer bonding technique Teo, Kim Poh. Goh, Wang Ling School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging In this project, the realization of a trenched SOI substrate is carried out, and the characterization of the CMP planarization together with a new polysilicon shallow trench isolation (STI) technique is studied. Doctor of Philosophy (EEE) 2008-09-17T09:32:22Z 2008-09-17T09:32:22Z 2001 2001 Thesis http://hdl.handle.net/10356/3559 Nanyang Technological University application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| topic |
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| spellingShingle |
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Teo, Kim Poh. Realization of trenched SOI structure using wafer bonding technique |
| description |
In this project, the realization of a trenched SOI substrate is carried out, and the characterization of the CMP planarization together with a new polysilicon shallow trench isolation (STI) technique is studied. |
| author2 |
Goh, Wang Ling |
| author_facet |
Goh, Wang Ling Teo, Kim Poh. |
| format |
Theses and Dissertations |
| author |
Teo, Kim Poh. |
| author_sort |
Teo, Kim Poh. |
| title |
Realization of trenched SOI structure using wafer bonding technique |
| title_short |
Realization of trenched SOI structure using wafer bonding technique |
| title_full |
Realization of trenched SOI structure using wafer bonding technique |
| title_fullStr |
Realization of trenched SOI structure using wafer bonding technique |
| title_full_unstemmed |
Realization of trenched SOI structure using wafer bonding technique |
| title_sort |
realization of trenched soi structure using wafer bonding technique |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/3559 |
| _version_ |
1772827231432736768 |