Characterization of solder/UBM interface and materials properties

• Main Author: Ong, Kai Yie.
• Other Authors: Chen Zhong
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/35653
• Institution: Nanyang Technological University

Various attempts, such as varying the thickness and phosphorus content, have been made to slow down the consumption of UBM and formation of IMC. The current project chooses to focus on Ni-Sn-P UBM alloy. There is not much literature concerning Ni-Sn-P UBM alloy therefore more efforts have to be made...