Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask

The attenuated phase shifting mask has become very popular for printing via patterns in today’s semiconductor manufacturing industry. This is because this is suitable for patterns with any shapes. Also, it has an easier manufacturing technology. Its major disadvantage is the printability of side lob...

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Bibliographic Details
Main Author: Chen, Hao.
Other Authors: Chan, John Chok You
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3648
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Institution: Nanyang Technological University
Description
Summary:The attenuated phase shifting mask has become very popular for printing via patterns in today’s semiconductor manufacturing industry. This is because this is suitable for patterns with any shapes. Also, it has an easier manufacturing technology. Its major disadvantage is the printability of side lobes due to the light that is transmitted through the dark areas.