Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask

The attenuated phase shifting mask has become very popular for printing via patterns in today’s semiconductor manufacturing industry. This is because this is suitable for patterns with any shapes. Also, it has an easier manufacturing technology. Its major disadvantage is the printability of side lob...

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Main Author:	Chen, Hao.
Other Authors:	Chan, John Chok You
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:	http://hdl.handle.net/10356/3648
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-3648
record_format	dspace
spelling	sg-ntu-dr.10356-36482023-07-04T16:25:27Z Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask Chen, Hao. Chan, John Chok You School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics The attenuated phase shifting mask has become very popular for printing via patterns in today’s semiconductor manufacturing industry. This is because this is suitable for patterns with any shapes. Also, it has an easier manufacturing technology. Its major disadvantage is the printability of side lobes due to the light that is transmitted through the dark areas. Master of Science (Computer Control and Automation) 2008-09-17T09:34:30Z 2008-09-17T09:34:30Z 2003 2003 Thesis http://hdl.handle.net/10356/3648 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Chen, Hao. Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
description	The attenuated phase shifting mask has become very popular for printing via patterns in today’s semiconductor manufacturing industry. This is because this is suitable for patterns with any shapes. Also, it has an easier manufacturing technology. Its major disadvantage is the printability of side lobes due to the light that is transmitted through the dark areas.
author2	Chan, John Chok You
author_facet	Chan, John Chok You Chen, Hao.
format	Theses and Dissertations
author	Chen, Hao.
author_sort	Chen, Hao.
title	Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
title_short	Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
title_full	Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
title_fullStr	Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
title_full_unstemmed	Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
title_sort	optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
publishDate	2008
url	http://hdl.handle.net/10356/3648
_version_	1772829108485488640

Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask

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