Optimization of via patterns for 0.13 micrometer copper dual damascene technology using phase shift mask
The attenuated phase shifting mask has become very popular for printing via patterns in today’s semiconductor manufacturing industry. This is because this is suitable for patterns with any shapes. Also, it has an easier manufacturing technology. Its major disadvantage is the printability of side lob...
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| 格式: | Theses and Dissertations |
| 出版: |
2008
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| 在線閱讀: | http://hdl.handle.net/10356/3648 |
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| 機構: | Nanyang Technological University |