Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding

In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding (MVWB) and plasma activated wafer bonding (PAWB), are studied.

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Bibliographic Details
Main Author:	Yu, Weibo
Other Authors:	Wei Jun
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:	https://hdl.handle.net/10356/3934
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-3934
record_format	dspace
spelling	sg-ntu-dr.10356-39342023-07-04T17:13:58Z Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding Yu, Weibo Wei Jun Tan Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding (MVWB) and plasma activated wafer bonding (PAWB), are studied. DOCTOR OF PHILOSOPHY (EEE) 2008-09-17T09:40:40Z 2008-09-17T09:40:40Z 2005 2005 Thesis Yu, W. B. (2005). Fabrication and characterization of silicon- on- insulator using low temperature wafer bonding. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/3934 10.32657/10356/3934 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Yu, Weibo Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
description	In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding (MVWB) and plasma activated wafer bonding (PAWB), are studied.
author2	Wei Jun
author_facet	Wei Jun Yu, Weibo
format	Theses and Dissertations
author	Yu, Weibo
author_sort	Yu, Weibo
title	Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
title_short	Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
title_full	Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
title_fullStr	Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
title_full_unstemmed	Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
title_sort	fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
publishDate	2008
url	https://hdl.handle.net/10356/3934
_version_	1772825554616057856

Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding

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