Fabrication and characterization of silicon-on-insulator using low temperature wafer bonding
In present study, two low temperature wafer bonding methods, namely the medium vacuum wafer bonding (MVWB) and plasma activated wafer bonding (PAWB), are studied.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/3934 |
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| Institution: | Nanyang Technological University |