Study of copper contamination and copper induced particles for 2nd generation 300mm wafer fab

• Main Author: Chan, Jin Seng.
• Other Authors: Chen, Tupei
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/3293
• Institution: Nanyang Technological University

While defects have always been a concern in wafer processing, until recently little attention has focused on backside, edge and bevel defects, simply due to the lack of suitable methods and little awareness about their effects. The variety of backside defects can have a major impact on yield and...