Study of copper contamination and copper induced particles for 2nd generation 300mm wafer fab

• المؤلف الرئيسي: Chan, Jin Seng.
• مؤلفون آخرون: Chen, Tupei
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/3293
• المؤسسة: Nanyang Technological University

While defects have always been a concern in wafer processing, until recently little attention has focused on backside, edge and bevel defects, simply due to the lack of suitable methods and little awareness about their effects. The variety of backside defects can have a major impact on yield and...