Study of copper contamination and copper induced particles for 2nd generation 300mm wafer fab

While defects have always been a concern in wafer processing, until recently little attention has focused on backside, edge and bevel defects, simply due to the lack of suitable methods and little awareness about their effects. The variety of backside defects can have a major impact on yield and...

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Bibliographic Details
Main Author: Chan, Jin Seng.
Other Authors: Chen, Tupei
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3293
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Institution: Nanyang Technological University

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