Modeling of thermal behavior in phase change interconnects
A reconfigurable via with a phase change material, Ge2Sb2Te5 material is an interesting prospect to replace the current reconfigurable device technology. Its scalability, thermal stability and ability to achieve high-performance reconfigurable logic application without significantly sacrificing logi...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project |
| Language: | English |
| Published: |
2010
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/39837 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |