Modeling of thermal behavior in phase change interconnects

• المؤلف الرئيسي: Eng, Wee Hock
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/39837

A reconfigurable via with a phase change material, Ge2Sb2Te5 material is an interesting prospect to replace the current reconfigurable device technology. Its scalability, thermal stability and ability to achieve high-performance reconfigurable logic application without significantly sacrificing logi...