Modeling of thermal behavior in phase change interconnects

• Main Author: Eng, Wee Hock
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/39837
• Institution: Nanyang Technological University

A reconfigurable via with a phase change material, Ge2Sb2Te5 material is an interesting prospect to replace the current reconfigurable device technology. Its scalability, thermal stability and ability to achieve high-performance reconfigurable logic application without significantly sacrificing logi...