Modeling of thermal behavior in phase change interconnects
A reconfigurable via with a phase change material, Ge2Sb2Te5 material is an interesting prospect to replace the current reconfigurable device technology. Its scalability, thermal stability and ability to achieve high-performance reconfigurable logic application without significantly sacrificing logi...
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| 格式: | Final Year Project |
| 語言: | English |
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2010
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/39837 |
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