Fabrication and characterisation of low temperature bonding via copper nanowire arrays

This research involves the electrical and mechanical characterization of thermocompressionally bonded copper nanowires. Copper nanowires were fabricated via electrodeposition into anodic alumina oxide (AAO) templates. Electrodeposited samples were then diced into 1 mm by 1 mm chips before thermocomp...

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Main Author: Nadia Eddy Razali
Other Authors: Gan Chee Lip
Format: Final Year Project
Language:English
Published: 2011
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Online Access:http://hdl.handle.net/10356/44553
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-445532023-03-04T15:42:42Z Fabrication and characterisation of low temperature bonding via copper nanowire arrays Nadia Eddy Razali Gan Chee Lip School of Materials Science and Engineering DRNTU::Engineering This research involves the electrical and mechanical characterization of thermocompressionally bonded copper nanowires. Copper nanowires were fabricated via electrodeposition into anodic alumina oxide (AAO) templates. Electrodeposited samples were then diced into 1 mm by 1 mm chips before thermocompressionally bonded to an electrical test structure in a low vacuum furnace for 1 hour. Blanket copper film to film (F-F) samples were also bonded to the electrical test structures under the same bonding conditions. Copper nanowire samples (NW-F) were bonded to the electrical test structure at 200 °C and 300 °C, while F-F samples were bonded at 200 °C, 250 °C and 300 °C. Electrical characterization was done by four-point probe, while mechanical characterization was achieved by shear test. It was observed that blanket F-F samples exhibit an ohmic contact. On the other hand, NW-F samples resembled a Schottky contact. The resistance for samples bonded at 300 °C was generally higher than that of 200 °C and had a larger standard deviation for both F-F samples and NW-F samples. Shear strength results show that the bond strength for NW-F samples was higher than F-F samples at 200 °C. However, at 300 °C, the F-F samples had a higher shear strength than the NW-F samples. In both NW-F samples and F-F samples, the effect of the presence of oxides in the bond interface was extensive. Annealing in N2 and forming gas were carried out, but improvements on the electrical and mechanical properties were not significant. Bachelor of Engineering (Materials Engineering) 2011-06-02T04:39:19Z 2011-06-02T04:39:19Z 2011 2011 Final Year Project (FYP) http://hdl.handle.net/10356/44553 en Nanyang Technological University 53 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering
spellingShingle DRNTU::Engineering
Nadia Eddy Razali
Fabrication and characterisation of low temperature bonding via copper nanowire arrays
description This research involves the electrical and mechanical characterization of thermocompressionally bonded copper nanowires. Copper nanowires were fabricated via electrodeposition into anodic alumina oxide (AAO) templates. Electrodeposited samples were then diced into 1 mm by 1 mm chips before thermocompressionally bonded to an electrical test structure in a low vacuum furnace for 1 hour. Blanket copper film to film (F-F) samples were also bonded to the electrical test structures under the same bonding conditions. Copper nanowire samples (NW-F) were bonded to the electrical test structure at 200 °C and 300 °C, while F-F samples were bonded at 200 °C, 250 °C and 300 °C. Electrical characterization was done by four-point probe, while mechanical characterization was achieved by shear test. It was observed that blanket F-F samples exhibit an ohmic contact. On the other hand, NW-F samples resembled a Schottky contact. The resistance for samples bonded at 300 °C was generally higher than that of 200 °C and had a larger standard deviation for both F-F samples and NW-F samples. Shear strength results show that the bond strength for NW-F samples was higher than F-F samples at 200 °C. However, at 300 °C, the F-F samples had a higher shear strength than the NW-F samples. In both NW-F samples and F-F samples, the effect of the presence of oxides in the bond interface was extensive. Annealing in N2 and forming gas were carried out, but improvements on the electrical and mechanical properties were not significant.
author2 Gan Chee Lip
author_facet Gan Chee Lip
Nadia Eddy Razali
format Final Year Project
author Nadia Eddy Razali
author_sort Nadia Eddy Razali
title Fabrication and characterisation of low temperature bonding via copper nanowire arrays
title_short Fabrication and characterisation of low temperature bonding via copper nanowire arrays
title_full Fabrication and characterisation of low temperature bonding via copper nanowire arrays
title_fullStr Fabrication and characterisation of low temperature bonding via copper nanowire arrays
title_full_unstemmed Fabrication and characterisation of low temperature bonding via copper nanowire arrays
title_sort fabrication and characterisation of low temperature bonding via copper nanowire arrays
publishDate 2011
url http://hdl.handle.net/10356/44553
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