Fabrication and characterisation of low temperature bonding via copper nanowire arrays

• Main Author: Nadia Eddy Razali
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/44553
• Institution: Nanyang Technological University

This research involves the electrical and mechanical characterization of thermocompressionally bonded copper nanowires. Copper nanowires were fabricated via electrodeposition into anodic alumina oxide (AAO) templates. Electrodeposited samples were then diced into 1 mm by 1 mm chips before thermocomp...